Methods for forming bit line contacts and bit lines during the formation of a semiconductor device

ABSTRACT

A method for forming a semiconductor device comprises forming first and second bit lines at different levels. Forming the bit lines at different levels increases processing latitude, particularly the spacing between the bit lines which, with conventional processes, may strain photolithographic limits. A semiconductor device formed using the method, and an electronic system comprising the semiconductor device, are also described.

This application is a divisional of application Ser. No. 11/404,209,filed on Apr. 13, 2006, now U.S. Pat. No. 7,638,878, the entiredisclosure of which is hereby incorporated by reference.

FIELD OF THE INVENTION

This invention relates to the field of semiconductor manufacture,particularly to a method for forming bit line contacts and bit lines foruse with various semiconductor memory devices, as well as resultingstructures and devices and systems including those structures. Moreparticularly, the structure of the invention may have applicability in aNAND flash programmable read-only memory device.

BACKGROUND OF THE INVENTION

During the formation of a semiconductor device, particularly anonvolatile memory device such as a NAND flash programmable read-onlymemory (flash PROM, or “flash device”), several structures are commonlyformed. A typical flash device comprises various features as depicted inthe plan view of FIG. 1, and the cross sections A-A and B-B of FIG. 1depicted in FIGS. 2 and 3 respectively. FIGS. 1-3 depict a semiconductorwafer 10 comprising a first conductively doped region 12, for example awell region doped with a p-type dopant such as boron, and second dopedregions 14, for example active area regions doped with an n-type dopantsuch as phosphorous or arsenic. The device may also comprise a pluralityof transistors 16, 18, with transistors 16 providing memory gates andtransistors 18 providing select gates for writing to and reading fromthe memory gates. Each transistor comprises tunnel oxide 20, a floatinggate 22, intergate dielectric 24, a control gate (word line) 26, acapping dielectric layer 28 such as silicon nitride, and dielectricspacers 30 of silicon dioxide or silicon nitride. The doped waferregions 12, 14 may be isolated from adjacent doped regions (notdepicted) with shallow trench isolation (STI) structure 32. The FIGS.also depict one or more dielectric layers 34 such as tetraethylorthosilicate (TEOS) and/or borophosphosilicate glass (BPSG), bit line(digit line) contacts 36 electrically coupled with one of the seconddoped regions 14, and bit lines (digit lines) 38. The manufacture anduse of the device of FIGS. 1-3 is known in the art. An actual structuremay comprise other elements not immediately germane to the presentinvention, and which have not been depicted for ease of explanation.

Another bit line design is depicted in FIG. 4 and sections C-C, D-D, andE-E of FIGS. 5, 6, and 7 respectively. Elements of the FIGS. numbered inaccordance with the structures of FIGS. 1-3 have similar or identicalfunctions as described for the design of FIGS. 1-3. The structure ofFIGS. 4-7 has a reduced bit line contact height to width ratio (i.e. the“aspect ratio”) which must be etched for the bit line contacts over themethod described in FIGS. 1-3. In addition, the structure of FIGS. 4-7has reduced capacitance between the bit line and the gate due to thickerinterlayer dielectric (ILD).

The structure of FIGS. 4-7, for example section E-E of FIG. 4 depictedin FIG. 7, illustrates a first bit line contact portion 70 and a secondbit line contact portion 72 which are electrically connected by aconductive bit line contact interconnect 74. To form the structure, thefirst bit line contact portion 70 is formed, for example using adamascene contact process, then a polysilicon or metal layer is formed,masked, and etched to form the bit line contact interconnect 74. Anotherdamascene process may then be used to form the second bit line contactportion 72 to contact the interconnect 74. While layer 34 depicts asingle dielectric layer, this will in actuality comprise severaldifferent layers formed at different stages in the manufacturingprocess.

One problem which may occur during the formation of the structures ofFIGS. 1-3 and 4-7 results from the small pitch between adjacent digitline contacts. These contacts are depicted as element 36 in FIGS. 3 and70 in FIG. 5. A continual goal of design and process engineers isminiaturization of device features. As processes improve to increasefeature densities, the bit line contacts 36, 70 become smaller andcloser together. As optical photolithography and etching processes areoften pushed to their limits to maximize device densities and to reducecosts, bit line contacts may become increasingly susceptible to shortingwith adjacent bit line contacts to result in a malfunctioning ornonfunctioning device. Replacement of one or more nonfunctional columnsof transistors may be enabled with redundant columns, but this is a lessthan optimal solution which requires additional space on a semiconductordie.

One attempt to reduce the problem of shorted bit line contacts isdepicted in the plan view of FIG. 8, and the sectional views across F-Fand G-G depicted in FIGS. 9 and 10 respectively. With this design,adjacent bit line contacts are offset in an alternating pattern. Asdepicted in FIGS. 8 and 9, a first bit line contact portion 80 is formedwithin one or more layers of TEOS and/or BPSG 34, and a second bit linecontact portion 82 is formed within one or more layers of TEOS and/orBPSG 84. The second bit line contact portion 82 is formed to beelectrically coupled with the first bit line contact portion 80, and bitline 38 is formed to contact the second bit line contact portion 82.Thus the bit line portions 80, 82 provide an electrical pathway betweenthe bit line 38 and one of the doped active area regions 14.

One problem with the design of FIGS. 8-10 is that the process requiresseveral mask layers which have little processing latitude. A first maskmust be used to etch the opening in layer 34 to receive the layer 80, asecond mask must be used to etch the opening in layer 84 to receivelayer 82, and a third mask must be used to etch the opening whichreceives layer 38. Additionally, the openings for layers 82 and 38 mustbe properly aligned with layer 80, which becomes more difficult withdecreasing feature sizes and may be a cause of product failure andincrease costs.

Further, as the distance between adjacent bit lines 38 decreases, thewidth of the bit lines must also decrease to ensure proper electricalisolation between columns of bit lines. With decreasing width, theresistance along the bit lines may increase beyond desirable levelswhich may contribute to device malfunction of failure. Wider bit linesare desired from an electrical standpoint to improve electricalcharacteristics, while narrower bit lines are desired to maximize devicedensity. Additionally, the capacitive coupling between adjacent bitlines increases as the distance between them decreases. This increasingcapacitance slows program and read performance due to increased timesrequired for bit line precharge and discharge.

A method for forming a bit line contact, and a structure resulting fromthe method, which reduces or eliminates the problems described abovewould be desirable.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view, and FIGS. 2 and 3 are cross sections, depictingvarious structures formed using a first conventional bit line process;

FIG. 4 is a plan view, and FIGS. 5-7 are cross sections, depictingvarious structures formed using a second conventional bit line process;

FIG. 8 is a plan view, and FIGS. 9 and 10 are cross sections, depictingvarious structures formed using a third conventional bit line process;

FIGS. 11, 15, 18, and 29 are plan views, and FIGS. 12-14, 16, 17, 19-28,30, and 31 are cross sections, depicting various structures formed usinga first embodiment of an inventive bit line process;

FIGS. 32-37 are cross sections depicting various structures formed usinga second embodiment of the inventive bit line process;

FIGS. 38-47 are cross sections depicting various structures formed usinga third embodiment of the inventive bit line process;

FIG. 48 is a plan view, and FIG. 49 is a cross section along J-J of theFIG. 48 structure, depicting a structure comprising an embodiment of theinvention;

FIGS. 50 and 51 are cross sections along J-J of the structures of FIGS.42 and 46 respective;

FIGS. 52 and 53 are cross sections of FIG. 48 along K-K and L-Lrespectively;

FIG. 54 is a cross section, and FIG. 55 is a plan view, of anotherembodiment of the invention with bit lines having upper surfaces at twodifferent levels, with the bottom surfaces being at the same level in anonstaggered (linear) bit line contact arrangement;

FIGS. 56 and 57 are cross sections of another staggered bit linearrangement;

FIG. 58 is a cross section of another nonstaggered bit line contactarrangement;

FIG. 59 is an isometric depiction of various components which may bemanufactured using devices formed with an embodiment of the presentinvention; and

FIG. 60 is a block diagram of an exemplary use of the invention to formpart of a memory device having a storage transistor array.

It should be emphasized that the drawings herein may not be to exactscale and are schematic representations. The drawings are not intendedto portray the specific parameters, materials, particular uses, or thestructural details of the invention, which may be determined by one ofskill in the art by examination of the information herein.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

The present invention provides a method which, among other advantages,reduces problems associated with the manufacture of semiconductordevices, particularly problems resulting during the formation of bitline contacts and other contacts. In one embodiment, a first conductivebit line layer is formed at a first vertical level, and a second,conductive bit line layer is formed at a second vertical level over asemiconductor wafer, with the second level being more outwardly locatedon the wafer than the first level. The bit lines formed at the secondlevel are self-aligned to the bit lines formed at the first level (i.e.a separate mask layer is not necessary to align the second bit lineswith the first bit lines) with each second level bit line being adjacentto at least one first level bit line (i.e. next to each other with noother bit line laterally interposed between the first level bit line andthe second level bit lines). Further, a majority of the length of thesecond bit line, for example 80% or more of the length, is moreoutwardly located on the semiconductor wafer than 80% of the uppersurface of the first bit line. As bit line contacts of adjacent bitlines may be offset, a portion of the first bit line at a given crosssection, particularly at a cross section near the second bit linecontact, may be more outwardly located on the semiconductor wafer thanthe second bit line.

In one embodiment, an etch to form contacts or plugs for the secondlevel bit lines uses a mask with a large processing latitude, forexample up to half the width of the bit lines. Further, the bit linesthemselves may be formed to have an increased width when compared to bitlines formed using conventional processes, thereby decreasing electricalresistance and increasing conductivity. Contacts for adjacent bit linesmay comprise various arrangements, for example linear or offset (i.e.“staggered”).

The term “wafer” is to be understood as a semiconductor-based materialincluding silicon, silicon-on-insulator (SOI) or silicon-on-sapphire(SOS) technology, doped and undoped semiconductors, epitaxial layers ofsilicon supported by a base semiconductor foundation, and othersemiconductor structures. Furthermore, when reference is made to a“wafer” in the following description, previous process acts may havebeen utilized to form regions or junctions in or over the basesemiconductor structure or foundation. Additionally, when reference ismade to a “substrate assembly” in the following description, thesubstrate assembly may include a wafer with layers including dielectricsand conductors, and features such as transistors, formed thereover,depending on the particular stage of processing. In addition, thesemiconductor need not be silicon-based, but may be based onsilicon-germanium, silicon-on-insulator, silicon-on-sapphire, germanium,or gallium arsenide, among others. Further, in the discussion and claimsherein, the term “on” used with respect to two layers, one “on” theother, means at least some contact between the layers, while “over”means the layers are in close proximity, but possibly with one or moreadditional intervening layers such that contact is possible but notrequired. Neither “on” nor “over” implies any directionality as usedherein. The term “about” indicates that the value listed may be somewhataltered, as long as the alteration does not result in an excessivenegative impact to the process or structure. A “spacer” indicates alayer, typically dielectric, formed over uneven topography as aconformal layer then anisotropically etched to remove horizontalportions of the layer and leaving vertical portions of the layer.

A first embodiment of an inventive method for forming bit line contacts(or “plugs”) and bit lines is depicted in FIGS. 11-31. FIG. 11 is a planview, and FIGS. 12-14 are cross sections along H-H, I-I, and J-Jrespectively of FIG. 11, of an in-process semiconductor devicecomprising a semiconductor wafer substrate assembly having the followingstructures: semiconductor wafer 10; a first doped region 12 in wafer 10,for example a well doped with a p-type dopant such as boron; seconddoped regions 14, for example doped with an n-type dopant such asphosphorous or arsenic, which may be referred to as the “active area;”and transistor word lines 16 providing memory gates 16 and word lines 18providing select gates 18 for writing to and reading from the memorygates. Each memory cell comprises: tunnel oxide 20; floating gate 22;intergate dielectric 24; control gate (word line) 26; capping dielectriclayer 28 such as silicon nitride; and dielectric spacers 30, for exampleformed from silicon nitride. The semiconductor wafer substrate assemblyfurther comprises: shallow trench isolation (STI) structure 32; one ormore dielectric layers 34 such as tetraethyl orthosilicate (TEOS) and/orborophosphosilicate glass (BPSG); and first 110 and second 112 bit linecontacts, for example comprising one or more of tungsten nitride(WN_(x)), polysilicon, tungsten silicide, or one or more other suitablematerials. Bit line contacts 110 are offset in the vertical andhorizontal directions from bit line contacts 112. The offset in thevertical direction (i.e. the vertical distance between the top of bitline 110 and the bottom of bit line 112) is targeted to preventunintentional shorts between adjacent bit lines. The offset in thehorizontal direction is determined by the width of one shallow trenchisolation (STI) structure 32 feature (seen by comparing FIGS. 13 and 14,for example) to provide a “staggered” layout.

Bit line contacts 110, 112 will typically be simultaneously formed, andare identified with different element numbers to differentiate them inthe subsequent FIGS. for ease of explanation. Further, an actualsemiconductor structure design will likely comprise other elements notimmediately germane to the present invention, and which have not beendepicted for ease of explanation. The structure of FIGS. 11-14 may bemanufactured by one of ordinary skill in the art from the descriptionherein.

It should be noted that the cross sections of the following figures,which are generally paired, may be noted as being taken across I-I andJ-J at the locations depicted in FIG. 11, but will typically be taken atdifferent processing stages or variations to the FIG. 11 stage. Thecross sections comprising first bit line contacts 110 are generallytaken at I-I, while the cross sections comprising second bit linecontacts are generally taken at J-J.

After forming the structure of FIGS. 11-14, a blanket conductive firstbit line layer 160, a blanket dielectric layer 162 such as siliconnitride (Si₃N₄), and a first patterned photoresist layer (resist) 164are formed as depicted in FIGS. 15-17. Resist 164 defines first bitlines which will contact the first bit line contacts 110. After formingbit line layer 160, dielectric layer 162, and resist 164, the dielectriclayer 162 and bit line layer 160 are etched to define first bit lines160 as depicted in FIGS. 18-20.

As depicted in FIGS. 18-20, as a result of the etch of the structure ofFIGS. 15-18 the first bit lines 160 are electrically coupled with thefirst bit line contacts 110, but conductive layer 160 has been removedfrom the second bit line contacts 112. Thus conductive layer 160 whichoriginally contacted both the first 110 and second 112 bit line contactsis etched to remove conductive layer 160 from the second bit linecontacts 112. After etching using resist 164 as a mask, the resist 164is removed and dielectric spacers 180 are formed along the sidewalls oflayers 160, 162 according to techniques known in the art to result inthe structure of FIGS. 18-20. Spacers 180 may be formed from a materialsimilar to layer 162, in the present embodiment Si₃N₄. As also depictedin FIG. 20, each spacer may be formed such that the edge of each spaceraligns or nearly aligns with the edge of one of the second contact plugs112. As may be determined from subsequent processing, aligning spacers180 with second contact plugs 112 maximizes the density of the pertinentfeatures on the device while allowing minimum resistance between bitline contacts 112 and bit lines subsequently formed.

After forming the structure of FIGS. 18-20, a blanket dielectric layersuch as TEOS or BPSG is formed and planarized down to the level of thetop of capping layer 162, then a second patterned photoresist layer isformed to cover the dielectric layer over the first bit line contactsand to expose the dielectric layer over the second bit line contacts.The exposed dielectric is then etched to result in the structure ofFIGS. 21 and 22, which comprises the remaining planarized portions ofthe dielectric layer 210 over first bit line contacts 110, and furthercomprises the second resist 212. Because the spacers 180 and cappinglayer 162 comprise Si₃N₄ and layer 210 comprises oxide, the oxide may beetched selective to the nitride (i.e. the etch removes oxide with littleor no etching of the nitride) so that the second bit line contacts 112are exposed. This further enables the pattern of the second resist 212to have sufficient processing latitude so that mask misalignment is nota significant concern. As may be determined by reviewing FIG. 22, thesecond resist 212 may be misaligned by up to half the width of the firstbit lines 160 plus the full width of a spacer 180.

Next, the second resist 212 is removed and a blanket conductive pluglayer 230, for example tungsten, is formed on exposed surfaces asdepicted in FIGS. 23 and 24. Layer 230 contacts the second bit linecontacts 112, and is prevented from contacting the first bit linecontacts 110 by dielectric layer 210. The blanket conductive layer 230is then planarized, for example using mechanical polishing such aschemical mechanical polishing (CMP), down to the level of the top ofcapping layer 162 to result in the second bit line portions 230 depictedin FIGS. 25 and 26. An over etch may be employed to ensure that all ofthe conductive layer is removed from over the capping layer 162, or itmay be removed during the next patterning act of the second bit lines.

Next, another blanket conductive layer such as aluminum is formed overthe first bit line layer 160 and on the plug layer 230, then a thirdpatterned photoresist layer is formed. The third patterned resist layerwill define the second bit lines coupled to the second bit line contacts112. An etch is performed to define the second bit lines 270 using thethird resist 272 as a pattern to result in the structure of FIGS. 27 and28. In this embodiment, vertically oriented edges of second bit lines270 are, preferably, vertically aligned with vertically oriented edgesof first bit lines 162. While this vertical alignment is preferred, somemisalignment of the resist 272 may be tolerated but may result incapacitive interference between the first 160 and second 270 bit lines,and will increase resistance between layers 230 and 270. Thus the secondbit lines 270 are electrically coupled to the second bit line plugs 112through second bit line portions 230. Thus the second bit lines 270comprise a different layer than the first bit lines. That is, they maybe formed from the same material, but are different layers as they areformed at different times in the process.

After forming the structure of FIGS. 27 and 28, the third resist layer272 is removed and a planarized dielectric layer 300 such as TEOS orBPSG is formed to result in the structure depicted in the plan view ofFIG. 29, and the cross sections of FIGS. 30 and 31 taken at I-I and J-Jrespectively. As depicted in FIG. 29, each bit line 160, 270 isgenerally parallel with each of the other bit lines. While FIG. 29depicts the bit lines 160, 270 running in a single direction, the bitlines may weave around features at other locations not depicted. Waferprocessing then continues according to techniques known in the art toform a completed semiconductor device.

A semiconductor device formed in accordance with the method of FIGS.11-31 has various advantages over previous methods. For example, thefirst 160 and second 270 bit lines may be formed wider than previousadjacent bit lines. This results from the two layers being formed atdifferent levels. Referring to FIG. 30, the vertical edges of adjacentfirst 160 and second 270 bit lines may be coplanar, which would not bepossible if they were formed at the same level as preventing contactwould be difficult. With an alternate embodiment, the second bit linesmay even overlap the first bit lines; however, as previously stated,this may result in interference from capacitive coupling between the twobit line layers. Further, with the described and depicted embodiment,the second bit line portions 230 are self-aligned to the first bit lines160 such that some misalignment of the mask 272 which defines the secondbit lines 270 may be tolerated by the process, thus increasingprocessing latitude.

Another embodiment of the invention is depicted in FIGS. 32-37. Withthis embodiment, the wafer is first processed according to the previousembodiment up to the stage depicted in FIGS. 18-20. Next, a planarizeddielectric layer 320, such as one or more silicon dioxide layers, and apatterned photoresist layer 322 are formed as depicted in FIGS. 32 and33, which depict the cross sections at I-I and J-J respectively at FIG.11. Resist 322 leaves exposed regions overlying the second bit linecontacts 112, while covering regions overlying the first bit linecontacts 110.

An anisotropic oxide etch of the structure of FIGS. 32 and 33 isperformed to expose the second bit line contacts 112. Resist layer 322is then removed, and a blanket conductive layer 340, such as a metallayer, is formed to contact the second bit line contacts 112. Thisresults in the structure of FIGS. 34 and 35.

The blanket conductive layer 340 of FIGS. 34 and 35 is then planarized,for example using CMP, but to a level above the upper surface of layer320. Otherwise, the second bit lines 340 depicted in FIG. 36 will beremoved and the result in a bit line open unless further processing isperformed. After planarizing layer 340, a patterned photoresist layer(not depicted) is formed over layer 340 which defines the second bitlines. Layer 340 is etched to define second bit lines 340 depicted inFIGS. 36 and 37. After defining second bit lines 340, a planarizeddielectric layer 360 is formed to result in the structure of FIGS. 36and 37. Wafer processing may then continue to form a completedsemiconductor device.

It should be noted that other features may be present in the structureof FIGS. 36 and 37, as well as the other FIGS., which are not describedor depicted. For example, depending on the materials used, it may bedesirable to form a conductive enhancement layer on the bit line plugs112 prior to forming the second bit lines 340 to aid electrical contactbetween features 112 and 340, or as an adhesion layer.

As depicted in FIGS. 36 and 37, an upper surface of first bit lines 160is at a lower level than an upper surface of second bit lines 340. Atthe cross section depicted in FIG. 36, the lower surface of the secondbit lines 340 is at a higher level than the upper surface of the firstbit lines 160. At the cross section depicted in FIG. 37, the uppersurface of the second bit lines is also at a higher level than the uppersurface of the first bit lines 160, while the lower surfaces of thefirst 160 and second 340 bit lines are at the same level.

A semiconductor device formed in accordance with the embodiment of FIGS.32-37 offers the advantage over conventional processing methods ofproviding a second bit line have a decreased resistance due to anincreased cross sectional area, as depicted in FIG. 37. Bit lineresistance may be reduced by half. Capacitance between adjacent bitlines may also be reduced. Increased speeds of both cell programming andreading are also possible.

A third embodiment of the present invention is depicted in FIGS. 38-47.With this embodiment, the following structures depicted in the crosssections of FIGS. 38 and 39, taken at a location analogous to I-I andJ-J respectively of FIG. 11, for example, may be first formed orprovided in accordance with previous embodiments: a semiconductor wafer10; well region(s) 12; doped regions (active areas) 14; shallow trenchisolation structure 32; one or more dielectric layers 34; first bit linecontacts 110; and second bit line contacts 112. With this embodiment,the layer providing the bit line contacts 110, 112 may also be used toprovide a source local interconnect (depicted in FIGS. 48 and 49 aselement 480) at another location over the semiconductor wafer 10.

After forming the structures described above and depicted in FIGS. 38and 39, a dielectric layer 380 such as one or more layers of TEOS orBPSG are provided, and a patterned photoresist layer 382 is formed whichexposes the first bit line contacts 110 to complete the structure ofFIGS. 38 and 39.

Next, an etch of the dielectric layer is performed to provide openingsin dielectric layer 380 which expose bit line contacts 110.Subsequently, the resist layer 382 is removed, and conductive plugs areformed within the openings, for example using a damascene process. Thisforms first supplemental plugs 400 as depicted in FIG. 40 which contactthe first bit line contacts 110. The supplemental plugs 400 may beformed to a different dimension than the first bit line contacts 110, orto the same dimension as depicted.

After completing the structure of FIGS. 40 and 41, first bit lines 160,a silicon nitride capping layer 162, silicon nitride spacers 180, anoxide dielectric layer 320, and a patterned photoresist layer 322 areformed, for example in accordance with the embodiment depicted at FIGS.32 and 33. The oxide dielectric layer 320 and dielectric layer 380 areetched to expose the second bit lines 112 then the resist layer 322 isremoved. Next, a blanket conductive layer 440 such as tungsten isformed, then a patterned photoresist layer 442 is formed to result inthe structures depicted in FIGS. 44 and 45. The blanket conductive layermay be formed from a metal such as tungsten or titanium by chemicalvapor deposition or sputtering.

Subsequently, the blanket conductive layer 440 is etched, the patternedphotoresist layer 442 is removed, and a covering dielectric layer 460 isformed to result in the structure of FIGS. 46 and 47. Wafer processingmay then continue to form a completed semiconductor device.

The embodiment described above and depicted in FIGS. 38-47 has theadvantage of allowing a source local interconnect to be formed using thesame layer as the first and second bit line contacts 110, 112. Also bitline resistance may be reduced, as well as capacitance between adjacentbit lines may also be reduced. Increased speeds of both cell programmingand reading are also possible.

FIG. 48 is a plan view, and FIG. 49 is a cross section along J-J of theFIG. 48 structure, depicting a source local interconnect 480electrically coupled with a source line 482 through physical contacttherewith. The source local interconnect may be formed using the methoddepicted in FIGS. 38-47 from the conductive layer which forms plug 110,and the source line 482 may be formed from bit line layer 160. FIGS. 48and 49 further depict other like-numbered features previously described.

FIG. 50 is a cross section along J-J (analogous to cross section J-J ofFIG. 48) of the FIG. 42 structure after removing photoresist layer 322.

FIG. 51 is a cross section along J-J (analogous to cross section J-J ofFIG. 48) of the FIGS. 46 and 47 structure.

FIGS. 52 and 53 depict the FIG. 48 structure at cross sections K-K andL-L respectively.

FIGS. 54 and 55 depict another embodiment of the invention comprisinglinear (i.e. “nonstaggered”) bit line contacts. In this embodiment, atop surface of bit line 160 is below a top surface of bit lines 340. Thevertical sidewalls of bit lines 340 align with the vertical surfaces ofbit lines 160, and may be formed to overlie bit lines 160 if sufficientdistance is maintained between them to minimize capacitive couplingbetween adjacent bit lines.

The majority of the previous drawing figures provide for a semiconductordevice having fairly relaxed design rules. FIGS. 56 and 57 depictstructures analogous to FIGS. 46 and 47 respectively, but are designedto provide a higher number of features in a given area (i.e. to increasethe feature density) which decreases processing latitude.

Thus with various embodiments of the present invention, the bit lineswhich comprise the select gates 18 may be formed nonsimultaneously (i.e.either before or after) with the formation of the bit lines whichcomprise the memory gates 16. In the FIG. 58 structure, the second bitlines 340 are formed after forming the first bit lines 160, in anonstaggered, linear arrangement of bit line contacts. In thisembodiment, the second bit lines 340 directly overlie the first bitlines 160 and may minimize the horizontal area required for deviceformation while providing for bit lines having cross sections sufficientto maximize conductivity and minimize resistance.

As depicted in FIG. 59, a semiconductor device 590 formed in accordancewith the invention from a semiconductor wafer section may be attachedalong with other devices such as a microprocessor 592 to a printedcircuit board 594, for example to a computer motherboard or as a part ofa memory module used in a personal computer, a minicomputer, or amainframe 596. FIG. 59 may also represent use of device 590 in otherelectronic devices comprising a housing 596, for example devicescomprising a microprocessor 592, related to telecommunications, theautomobile industry, semiconductor test and manufacturing equipment,consumer electronics, or virtually any piece of consumer or industrialelectronic equipment.

The process and structure described herein may be used to manufacture anumber of different structures comprising conductive lines such as bitlines formed according to the inventive process. FIG. 60, for example,is a simplified block diagram of a memory device such as a dynamicrandom access memory having bit lines which may be formed using anembodiment of the present invention. The general operation of such adevice is known to one skilled in the art. FIG. 60 depicts a processor592 coupled to a memory device 590, and further depicts the followingbasic sections of a memory integrated circuit: control circuitry 600;row 602 and column 604 address buffers; row 606 and column 608 decoders;sense amplifiers 610; memory array 612; and data input/output 614.

While this invention has been described with reference to illustrativeembodiments, this description is not meant to be construed in a limitingsense. Various modifications of the illustrative embodiments, as well asadditional embodiments of the invention, will be apparent to personsskilled in the art upon reference to this description. It is thereforecontemplated that the appended claims will cover any such modificationsor embodiments as fall within the true scope of the invention.

1. A method comprising: forming a plurality of conductive bit line plugsat a first cross-sectional location and at a second cross-sectionallocation; forming a first blanket conductive bit line layer whichcontacts the plurality of conductive bit line plugs at the first andsecond cross-sectional locations; and removing a portion of the firstblanket conductive bit line layer to form a plurality of first bit lineswhich contact the bit line plugs at the first location, but which isremoved from contact with the bit line plugs at the second location. 2.The method of claim 1 further comprising: forming a second blanketconductive bit line layer over the first bit lines and which contactsthe bit line plugs at the second location; and removing a portion of thesecond blanket conductive bit line layer to form a plurality of secondbit line portions which contact the bit line plugs at the secondlocation, but which do not contact the bit line plugs at the firstlocation.
 3. The method of claim 2 further comprising planarizing thesecond blanket conductive bit line layer to remove the second blanketconductive bit line layer from over the plurality of first bit lines toform the second bit line portions.
 4. The method of claim 2 furthercomprising: forming a third blanket conductive bit line layer over thefirst bit lines which are electrically coupled to the bit line plugs atthe second location through electrical contact with the second bit lineportions; and removing the third blanket conductive bit line layer fromover the first bit lines.
 5. The method of claim 4 wherein a bottomsurface of the third blanket conductive layer at the firstcross-sectional location is above a top surface of the first bit lines.6. The method of claim 2 further comprising: forming a third blanketconductive bit line layer over the first bit lines which is electricallycoupled to the bit line plugs at the second location through electricalcontact with the second bit line portions; and removing a first portionof the third blanket conductive layer from over the first bit lines andleaving a second portion of the third blanket conductive layer over thefirst bit lines.
 7. A method comprising: forming a plurality ofconductive bit line plugs at a first cross-sectional location and at asecond cross-sectional location; forming a first blanket conductive bitline layer which contacts the plurality of conductive bit line plugs atthe first and second cross-sectional locations; and removing a portionof the first blanket conductive bit line layer to form a plurality offirst bit lines which contact the bit line plugs at the first location,but which is removed from contact with the bit line plugs at the secondlocation; forming a dielectric layer over the plurality of first bitlines and bit line plugs at the first cross-sectional location, and overthe first bit lines and bit line plugs at the second cross-sectionallocation; forming a patterned mask over the bit line plugs at the firstcross-sectional location and over the first bit lines at both the firstand second cross-sectional locations, wherein the bit line plugs at thesecond location are uncovered by the patterned mask; etching thedielectric layer using the patterned mask as a pattern to form aplurality of openings in the dielectric layer which expose the bit lineplugs at the second location; forming a second conductive bit line layerover both the dielectric layer and over the first bit line layer at thefirst and second cross-sectional locations, and within the plurality ofopenings in the dielectric layer to contact the bit line plugs at thesecond cross-sectional location, wherein the second conductive bit linelayer does not contact the bit line plugs at the first cross-sectionallocation; and etching the second conductive hit line layer at the firstand second cross-sectional locations to form a plurality of second bitlines, wherein at least a portion of the second conductive bit linelayer remains within the plurality of openings at the secondcross-sectional location and over the dielectric layer at the firstcross-sectional location subsequent to the etching of the secondconductive bit line layer.
 8. The method of claim 7 further comprising:forming the second conductive bit line layer on the dielectric layer atboth the first and second cross-sectional locations; planarizing thesecond conductive bit line layer; and subsequent to planarizing thesecond conductive bit line layer, performing the etch of the secondconductive bit line layer, wherein subsequent to the etch an uppersurface of the second conductive bit line layer at both the first andsecond cross-sectional locations is above an upper surface of thedielectric layer at the first and second cross-sectional locations. 9.The method of claim 7 further comprising performing the etch of thesecond conductive bit line layer such that subsequent to the etch alower surface of the second bit lines at the first cross-sectionallocation is above an upper surface of the first bit lines at the firstcross-sectional location.
 10. A method comprising: providing a pluralityof conductive plugs within a first dielectric layer at a firstcross-sectional location and at a second cross-sectional location,wherein each conductive plug electrically contacts one of a plurality ofconductive regions of a semiconductor structure; forming a first blanketconductive layer to electrically contact the conductive plugs at thefirst cross-sectional location; forming a blanket second dielectriclayer over the blanket conductive layer; etching the blanket seconddielectric layer and the blanket conductive layer to form a plurality offirst conductive lines from the first blanket conductive layer, whereina conductive line contacts each of the conductive plugs at the firstcross-sectional location; forming a second blanket conductive layerwhich contacts the conductive plugs at the second cross-sectionallocation; and removing the second blanket conductive layer from over atleast a portion of at least one of the first conductive lines at thefirst cross-sectional location and to leave the second conductive layercontacting the conductive plugs at the second cross-sectional location.11. The method of claim 10 wherein subsequent to removing the blanketsecond dielectric layer, both the first cross-sectional location and thesecond cross-sectional location comprise at least one first conductiveline.
 12. The method of claim 10, further comprising: forming a blanketthird dielectric layer over the plurality of first conductive lines,over the conductive plugs at the first cross-sectional location, andover the conductive plugs at the second cross-sectional location;planarizing the blanket third dielectric layer such that a portion ofthe third dielectric layer remains between the adjacent first conductivelines at both the first cross-sectional location and at the secondcross-sectional location; forming a patterned photoresist layer over thefirst conductive lines and over the conductive plugs at the firstcross-sectional location, but which leaves the third dielectric layer,the conductive plugs, and at least one first conductive line at thesecond cross-sectional location uncovered by the patterned photoresistlayer; and etching the third dielectric layer at the secondcross-sectional location to expose the conductive plugs at the secondcross-sectional location, while the third dielectric layer at the firstcross-sectional location remains over the first conductive lines andover the conductive plugs at the first cross-sectional location.
 13. Themethod of claim 12 further comprising forming a plurality of spacersalong first and second sidewalls of the first conductive lines such thatan edge of each spacer is substantially aligned with an edge of one ofthe conductive plugs at the second cross-sectional location.
 14. Themethod of claim 10 further comprising forming a portion of a secondconductive line over a portion of at least one of the first conductivelines.
 15. The method of claim 10, further comprising, prior to formingthe first blanket conductive layer: forming a third dielectric layerover the conductive plugs at both the first cross-sectional location andthe second cross-section location; etching the third dielectric layer toprovide openings in the third dielectric layer that expose theconductive plugs at the first cross-sectional location; and formingsupplemental plugs within the openings that contact the conductive plugsat the first cross-sectional location, wherein forming a first blanketconductive layer to electrically contact the conductive plugs at thefirst cross-sectional location comprises forming the first blanketconductive layer to physically contact the supplemental plugs at thefirst cross-sectional location.
 16. The method of claim 10, whereinforming a first blanket conductive layer to electrically contact theconductive plugs at the first cross sectional location comprises forminga first blanket conductive layer to electrically contact each of theconductive plugs at both the first cross sectional location and thesecond cross sectional location.
 17. The method of claim 10, whereinsubsequent to etching the blanket second dielectric layer and theblanket conductive layer to form a plurality of first conductive lines,no portion of the first blanket conductive layer contacts any of theconductive plugs at the second cross-sectional location.
 18. The methodof claim 10, further comprising providing a dielectric interposedbetween adjacent first conductive lines at the first cross sectionallocation, wherein the conductive plugs at the second cross sectionallocation are exposed, and wherein forming a second blanket conductivelayer comprises forming the second blanket conductive layer over thedielectric.
 19. The method of claim 10, wherein removing the secondblanket conductive layer from over at least a portion of at least one ofthe first conductive lines at the first cross-sectional locationcomprises planarizing the second blanket conductive layer.
 20. Themethod of claim 10, wherein removing the second blanket conductive layerto leave the second conductive layer contacting the conductive plugs atthe second cross-sectional location comprises forming second bit lineportions at the second cross-sectional location that contact theconductive plugs at the second cross-sectional location, and furthercomprising: forming a third conductive layer to contact the second bitline portions at the second cross-sectional location; and etching thethird conductive layer to form second conductive lines.
 21. The methodof claim 10, wherein removing the second blanket conductive layer toleave the second conductive layer contacting the conductive plugs at thesecond cross-sectional location comprises forming second conductivelines that contact the conductive plugs at the second cross-sectionallocation.